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Park, Kibog
Emergent Materials & Devices Lab.
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DC Field Value Language
dc.citation.conferencePlace JA -
dc.citation.conferencePlace Kyoto, Japan -
dc.citation.title 21st International Workshop on Junction Technology (IWJT 2023) -
dc.contributor.author Park, Kibog -
dc.date.accessioned 2024-01-04T22:35:09Z -
dc.date.available 2024-01-04T22:35:09Z -
dc.date.created 2024-01-04 -
dc.date.issued 2023-06-09 -
dc.identifier.bibliographicCitation 21st International Workshop on Junction Technology (IWJT 2023) -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/67688 -
dc.language 영어 -
dc.publisher IEEE Electron Device Society -
dc.title Modulating Electron Energy Barrier at Metal/Semiconductor and Metal/Insulator Contacts with Thin Interfacial Layer -
dc.type Conference Paper -
dc.date.conferenceDate 2023-06-08 -

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