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- Kim, Ju-Young
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | KO | - |
| dc.citation.title | ISMP 2023 | - |
| dc.contributor.author | Kwak. Ji-Youn | - |
| dc.contributor.author | Chery, Emmanuel | - |
| dc.contributor.author | Slabbekoorn, John | - |
| dc.contributor.author | Bertheau, Julien | - |
| dc.contributor.author | Messemaeker, Joke De | - |
| dc.contributor.author | Jeon, Eun-chae | - |
| dc.contributor.author | Kim, Ju-Young | - |
| dc.date.accessioned | 2024-01-02T11:05:11Z | - |
| dc.date.available | 2024-01-02T11:05:11Z | - |
| dc.date.created | 2023-12-30 | - |
| dc.date.issued | 2023-10-26 | - |
| dc.identifier.bibliographicCitation | ISMP 2023 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/67429 | - |
| dc.publisher | The Korean Microelectronics and Packaging Society (KMEPS) | - |
| dc.title | Reliability Investigations of Polymer Based Redistribution Layers(RDL) | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2023-10-25 | - |
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