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- Kim, Ju-Young
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | KO | - |
| dc.citation.title | 2023 한국기계가공학회 추계학술대회 | - |
| dc.contributor.author | Sim, Y. J | - |
| dc.contributor.author | Hwang, G. S | - |
| dc.contributor.author | Kim, Ju-Young | - |
| dc.date.accessioned | 2024-01-02T10:35:10Z | - |
| dc.date.available | 2024-01-02T10:35:10Z | - |
| dc.date.created | 2023-12-30 | - |
| dc.date.issued | 2023-11-30 | - |
| dc.identifier.bibliographicCitation | 2023 한국기계가공학회 추계학술대회 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/67412 | - |
| dc.publisher | 한국기계가공학회 | - |
| dc.title | 반도체 패키징용 구리와 고분자의 저온 하이브리드 본딩 | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2023-11-29 | - |
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