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- Kim, Ju-Young
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반도체 패키징용 구리와 고분자의 저온 하이브리드 본딩
- Author(s)
- Sim, Y. J, Hwang, G. S, Kim, Ju-Young
- Issued Date
- 2023-11-30
- Citation
- 2023 한국기계가공학회 추계학술대회
- Publisher
- 한국기계가공학회
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