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DC Field | Value | Language |
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dc.citation.number | 34 | - |
dc.citation.startPage | 2300290 | - |
dc.citation.title | SMALL | - |
dc.citation.volume | 19 | - |
dc.contributor.author | Mori, Yuki | - |
dc.contributor.author | Cheon, Taehoon | - |
dc.contributor.author | Kotsugi, Yohei | - |
dc.contributor.author | Kim, Youn‐Hye | - |
dc.contributor.author | Park, Yejin | - |
dc.contributor.author | Ansari, Mohd Zahid | - |
dc.contributor.author | Mohapatra, Debananda | - |
dc.contributor.author | Jang, Yujin | - |
dc.contributor.author | Bae, Jong‐Seong | - |
dc.contributor.author | Kwon, Woobin | - |
dc.contributor.author | Kim, Gahui | - |
dc.contributor.author | Park, Young‐Bae | - |
dc.contributor.author | Lee, Han‐Bo‐Ram | - |
dc.contributor.author | Song, Wooseok | - |
dc.contributor.author | Kim, Soo-Hyun | - |
dc.date.accessioned | 2023-12-21T12:39:24Z | - |
dc.date.available | 2023-12-21T12:39:24Z | - |
dc.date.created | 2023-06-07 | - |
dc.date.issued | 2023-08 | - |
dc.description.abstract | This study suggests a Ru/ZnO bilayer grown using area-selective atomic layer deposition (AS-ALD) as a multifunctional layer for advanced Cu metallization. As a diffusion barrier and glue layer, ZnO is selectively grown on SiO2, excluding Cu, where Ru, as a liner and seed layer, is grown on both surfaces. Dodecanethiol (DDT) is used as an inhibitor for the AS-ALD of ZnO using diethylzinc and H2O at 120 degrees C. H-2 plasma treatment removes the DDT adsorbed on Cu, forming inhibitor-free surfaces. The ALD-Ru film is then successfully deposited at 220 degrees C using tricarbonyl(trimethylenemethane)ruthenium and O-2. The Cu/bilayer/Si structural and electrical properties are investigated to determine the diffusion barrier performance of the bilayer film. Copper silicide is not formed without the conductivity degradation of the Cu/bilayer/Si structure, even after annealing at 700 degrees C. The effect of ZnO on the Ru/SiO2 structure interfacial adhesion energy is investigated using a double-cantilever-beam test and is found to increase with ZnO between Ru and SiO2. Consequently, the Ru/ZnO bilayer can be a multifunctional layer for advanced Cu interconnects. Additionally, the formation of a bottomless barrier by eliminating ZnO on the via bottom, or Cu, is expected to decrease the via resistance for the ever-shrinking Cu lines. | - |
dc.identifier.bibliographicCitation | SMALL, v.19, no.34, pp.2300290 | - |
dc.identifier.doi | 10.1002/smll.202300290 | - |
dc.identifier.issn | 1613-6810 | - |
dc.identifier.scopusid | 2-s2.0-85154570592 | - |
dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/64403 | - |
dc.identifier.wosid | 000979842500001 | - |
dc.language | 영어 | - |
dc.publisher | Wiley - V C H Verlag GmbbH & Co. | - |
dc.title | Self‐Formation of a Ru/ZnO Multifunctional Bilayer for the Next‐Generation Interconnect Technology via Area‐Selective Atomic Layer Deposition | - |
dc.type | Article | - |
dc.description.isOpenAccess | TRUE | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Multidisciplinary;Chemistry, Physical;Nanoscience & Nanotechnology;Materials Science, Multidisciplinary;Physics, Applied;Physics, Condensed Matter | - |
dc.relation.journalResearchArea | Chemistry;Science & Technology - Other Topics;Materials Science;Physics | - |
dc.type.docType | Article | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.subject.keywordAuthor | area-selective atomic layer deposition | - |
dc.subject.keywordAuthor | Cu metallization | - |
dc.subject.keywordAuthor | diffusion barriers | - |
dc.subject.keywordAuthor | Ru liner | - |
dc.subject.keywordAuthor | ZnO | - |
dc.subject.keywordPlus | DIFFUSION BARRIER PERFORMANCE | - |
dc.subject.keywordPlus | RU THIN-FILM | - |
dc.subject.keywordPlus | ASSEMBLED MONOLAYERS | - |
dc.subject.keywordPlus | THERMAL-STABILITY | - |
dc.subject.keywordPlus | COPPER DIFFUSION | - |
dc.subject.keywordPlus | CU | - |
dc.subject.keywordPlus | RUTHENIUM | - |
dc.subject.keywordPlus | GOLD | - |
dc.subject.keywordPlus | ADHESION | - |
dc.subject.keywordPlus | COEFFICIENT | - |
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