There are no files associated with this item.
Full metadata record
DC Field | Value | Language |
---|---|---|
dc.citation.endPage | 2717 | - |
dc.citation.number | 7 | - |
dc.citation.startPage | 2711 | - |
dc.citation.title | JOURNAL OF THE ELECTROCHEMICAL SOCIETY | - |
dc.citation.volume | 147 | - |
dc.contributor.author | Park, Ki‐Chul | - |
dc.contributor.author | Kim, Soo‐Hyun | - |
dc.contributor.author | Kim, Ki‐Bum | - |
dc.date.accessioned | 2023-12-22T12:07:13Z | - |
dc.date.available | 2023-12-22T12:07:13Z | - |
dc.date.created | 2023-01-30 | - |
dc.date.issued | 2000-07 | - |
dc.description.abstract | Titanium nitride (TiN) Rims were deposited using tetrakis(dimethylamido)titanium (TDMAT) as a precursor. During Rim growth, N- and Ar-ion beams with an energy of 120 eV were supplied in order to improve the film quality. The films deposited using a N-ion beam showed a resistivity of about 320 mu Omega,cm and density of 4 g/cm(3). The use of the N-ion beam, however, drastically degraded the step coverage of the film (below 5% at the 0.5 x 1.5 mu m contact). The films deposited using an Ar-ion beam showed a resistivity of about 800 mu Omega cm and density of 3.2 g/cm(3). The step coverage measured at the same contact was around 30%. For comparison, the thermally decomposed film showed a resistivity of about 5800 mu Omega cm and density of 2.5 g/cm(3). Finally, the diffusion barrier properties of 50 nm thick TiN films for Cu were investigated by the etch-pit test. The films deposited using N- and Ar-ion beam failed after annealing at 600 and 650 degrees C for 1 h, respectively, while thermally decomposed films failed at temperatures as low as 500 degrees C. It is thought that the improvements of the diffusion barrier performance of the films deposited using a N- and Ar-ion beam are the consequence of the film densification resulting from ion bombardment during film growth. (C) 2000 The Electrochemical Society. | - |
dc.identifier.bibliographicCitation | JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.147, no.7, pp.2711 - 2717 | - |
dc.identifier.doi | 10.1149/1.1393594 | - |
dc.identifier.issn | 0013-4651 | - |
dc.identifier.scopusid | 2-s2.0-0034224531 | - |
dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/64184 | - |
dc.identifier.url | https://iopscience.iop.org/article/10.1149/1.1393594/pdf | - |
dc.identifier.wosid | 000088125800048 | - |
dc.language | 영어 | - |
dc.publisher | ELECTROCHEMICAL SOC INC | - |
dc.title | Effect of ion bombardment during chemical vapor deposition of TiN films | - |
dc.type | Article | - |
dc.description.isOpenAccess | FALSE | - |
dc.relation.journalWebOfScienceCategory | Electrochemistry; Materials Science, Coatings & Films | - |
dc.relation.journalResearchArea | Electrochemistry; Materials Science | - |
dc.type.docType | Article | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.subject.keywordPlus | LOW-TEMPERATURE DEPOSITION | - |
dc.subject.keywordPlus | TITANIUM NITRIDE | - |
dc.subject.keywordPlus | CU METALLIZATION | - |
dc.subject.keywordPlus | DIFFUSION BARRIER | - |
dc.subject.keywordPlus | THIN-FILMS | - |
dc.subject.keywordPlus | PLASMA | - |
dc.subject.keywordPlus | LPCVD | - |
dc.subject.keywordPlus | DISCHARGES | - |
dc.subject.keywordPlus | PRECURSORS | - |
dc.subject.keywordPlus | AMMONIA | - |
Items in Repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Tel : 052-217-1404 / Email : scholarworks@unist.ac.kr
Copyright (c) 2023 by UNIST LIBRARY. All rights reserved.
ScholarWorks@UNIST was established as an OAK Project for the National Library of Korea.