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DC Field | Value | Language |
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dc.citation.endPage | 871 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | 866 | - |
dc.citation.title | SCIENCE OF ADVANCED MATERIALS | - |
dc.citation.volume | 8 | - |
dc.contributor.author | Park, In-Sun | - |
dc.contributor.author | Kim, Hongsik | - |
dc.contributor.author | Kim, Byoung O. | - |
dc.contributor.author | Choe, HeeHwan | - |
dc.contributor.author | Jeon, Jae-Hong | - |
dc.contributor.author | Ahn, Joongkyu | - |
dc.contributor.author | Kim, Soo-Hyun | - |
dc.contributor.author | Seo, Jong Hyun | - |
dc.date.accessioned | 2023-12-21T23:47:15Z | - |
dc.date.available | 2023-12-21T23:47:15Z | - |
dc.date.created | 2022-12-23 | - |
dc.date.issued | 2016-04 | - |
dc.description.abstract | In this work, both the adhesion properties and chemical properties of new NiCrSn alloys as a copper diffusion barrier layer on polymer substrates were examined using micro -scratch tests. The metal/polymer interfaces were examined using auger electron spectroscopy and X-ray photoemission spectroscopy. Compared to Ni-20 at% Cr alloy, the Ni-16 at% Cr-4 at% Sn alloy films have higher values of adhesion forces than that of Ni-20 at% Cr. In addition, the Ni-16 at% Cr-4 at% Sn alloy shows better wet pattering performance without remaining etch residue after wet pattering in 33% FeCl3 wet etchant. Such tendencies were explained in terms of the different types of metal oxide compounds forming at the metal/polymer interfaces which are dependent on the barrier metal's composition. | - |
dc.identifier.bibliographicCitation | SCIENCE OF ADVANCED MATERIALS, v.8, no.4, pp.866 - 871 | - |
dc.identifier.doi | 10.1166/sam.2016.2546 | - |
dc.identifier.issn | 1947-2935 | - |
dc.identifier.scopusid | 2-s2.0-84959898193 | - |
dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/64115 | - |
dc.identifier.url | https://www.ingentaconnect.com/content/asp/sam/2016/00000008/00000004/art00026 | - |
dc.identifier.wosid | 000373754500026 | - |
dc.language | 영어 | - |
dc.publisher | AMER SCIENTIFIC PUBLISHERS | - |
dc.title | A Study on Chemical and Mechanical Properties of NiCrSn Films for Flexible Copper Interconnect | - |
dc.type | Article | - |
dc.description.isOpenAccess | FALSE | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology; Materials Science, Multidisciplinary; Physics, Applied | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics; Materials Science; Physics | - |
dc.type.docType | Article | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.subject.keywordAuthor | NiCrSn Alloy | - |
dc.subject.keywordAuthor | Thin Film | - |
dc.subject.keywordAuthor | Wet Etching | - |
dc.subject.keywordAuthor | Adhesion Force | - |
dc.subject.keywordAuthor | Flexible Substrate | - |
dc.subject.keywordPlus | ADHESION STRENGTH | - |
dc.subject.keywordPlus | DIFFUSION | - |
dc.subject.keywordPlus | CR | - |
dc.subject.keywordPlus | METAL | - |
dc.subject.keywordPlus | MO | - |
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