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김수현

Kim, Soo-Hyun
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dc.citation.endPage 692 -
dc.citation.startPage 684 -
dc.citation.title JOURNAL OF ALLOYS AND COMPOUNDS -
dc.citation.volume 737 -
dc.contributor.author Nam, Taewook -
dc.contributor.author Lee, Chang Wan -
dc.contributor.author Cheon, Taehoon -
dc.contributor.author Lee, Woo Jae -
dc.contributor.author Kim, Soo-Hyun -
dc.contributor.author Kwon, Se-Hun -
dc.contributor.author Lee, Han-Bo-Ram -
dc.contributor.author Kim, Hyungjun -
dc.date.accessioned 2023-12-21T21:06:42Z -
dc.date.available 2023-12-21T21:06:42Z -
dc.date.created 2023-01-05 -
dc.date.issued 2018-03 -
dc.description.abstract The formation of thin amorphous cobalt titanium nitride (CoTiN) layers was investigated using a supercycle method of atomic layer deposition (ALD). The stoichiometry of the resultant ALD CoTiN films was controlled by changing the ratio of Co and TiN thicknesses. X-ray diffraction analysis and transmission electron microscopy observations showed that the microstructure of the ALD Co and TiN was transformed from polycrystalline to amorphous CoTiN. The stoichiometry of the CoTiN layer was affected by the growth characteristics of ALD Co and TiN on each surface. The results revealed that ALD TiN undergoes nucleation incubation on the ALD Co surface, whereas ALD Co does not undergo nucleation incubation on the ALD TiN surface. The properties of the amorphous CoTiN layers were evaluated by diffusion experiments and mechanical tests. Because of the lack of grain boundaries, the CoTiN efficiently blocks the diffusion of Cu at elevated temperatures and exhibits higher hardness compared with ALD Co. (c) 2017 Elsevier B.V. All rights reserved. -
dc.identifier.bibliographicCitation JOURNAL OF ALLOYS AND COMPOUNDS, v.737, pp.684 - 692 -
dc.identifier.doi 10.1016/j.jallcom.2017.12.023 -
dc.identifier.issn 0925-8388 -
dc.identifier.scopusid 2-s2.0-85038250197 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/64088 -
dc.identifier.url http://dx.doi.org/10.1016/j.jallcom.2017.12.023 -
dc.identifier.wosid 000419212900083 -
dc.language 영어 -
dc.publisher ELSEVIER SCIENCE SA -
dc.title Cobalt titanium nitride amorphous metal alloys by atomic layer deposition -
dc.type Article -
dc.description.isOpenAccess FALSE -
dc.relation.journalWebOfScienceCategory Chemistry, Physical; Materials Science, Multidisciplinary; Metallurgy & Metallurgical Engineering -
dc.relation.journalResearchArea Chemistry; Materials Science; Metallurgy & Metallurgical Engineering -
dc.type.docType Article -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.subject.keywordAuthor Amorphous metal alloy -
dc.subject.keywordAuthor Metal-metal nitride alloy -
dc.subject.keywordAuthor CoTiN -
dc.subject.keywordAuthor Atomic layer deposition -
dc.subject.keywordAuthor Interlayer formation -
dc.subject.keywordAuthor Diffusion barrier -
dc.subject.keywordPlus TIN THIN-FILMS -
dc.subject.keywordPlus DIFFUSION-BARRIERS -
dc.subject.keywordPlus MECHANICAL-PROPERTIES -
dc.subject.keywordPlus GROWTH-RATE -
dc.subject.keywordPlus CU -
dc.subject.keywordPlus COPPER -
dc.subject.keywordPlus PHASE -
dc.subject.keywordPlus TA -
dc.subject.keywordPlus SUPERCONDUCTIVITY -
dc.subject.keywordPlus NANOINDENTATION -

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