File Download

There are no files associated with this item.

  • Find it @ UNIST can give you direct access to the published full text of this article. (UNISTARs only)
Related Researcher

정창욱

Jeong, Changwook
Read More

Views & Downloads

Detailed Information

Cited time in webofscience Cited time in scopus
Metadata Downloads

Full metadata record

DC Field Value Language
dc.citation.number 9 -
dc.citation.title JOURNAL OF APPLIED PHYSICS -
dc.citation.volume 111 -
dc.contributor.author Jeong, Changwook -
dc.contributor.author Datta, Supriyo -
dc.contributor.author Lundstrom, Mark -
dc.date.accessioned 2023-12-22T05:08:52Z -
dc.date.available 2023-12-22T05:08:52Z -
dc.date.created 2022-04-01 -
dc.date.issued 2012-05 -
dc.description.abstract The question of what fraction of the total heat flow is transported by phonons with different mean-free-paths is addressed using a Landauer approach with a full dispersion description of phonons to evaluate the thermal conductivities of bulk and thin film silicon. For bulk Si, the results reproduce those of a recent molecular dynamic treatment showing that about 50% of the heat conduction is carried by phonons with a mean-free-path greater than about 1 mu m. For the in-plane thermal conductivity of thin Si films, we find that about 50% of the heat is carried by phonons with mean-free-paths shorter than in the bulk. When the film thickness is smaller than similar to 0.2 mu m, 50% of the heat is carried by phonons with mean-free-paths longer than the film thickness. The cross-plane thermal conductivity of thin-films, where quasi-ballistic phonon transport becomes important, is also examined. For ballistic transport, the results reduce to the well-known Casimir limit [H. B. G. Casimir, Physica 5, 495-500 (1938)]. These results shed light on phonon transport in bulk and thin-film silicon and demonstrate that the Landauer approach provides a relatively simple but accurate technique to treat phonon transport from the ballistic to diffusive regimes. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4710993] -
dc.identifier.bibliographicCitation JOURNAL OF APPLIED PHYSICS, v.111, no.9 -
dc.identifier.doi 10.1063/1.4710993 -
dc.identifier.issn 0021-8979 -
dc.identifier.scopusid 2-s2.0-84864254611 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/58474 -
dc.identifier.wosid 000304109900057 -
dc.language 영어 -
dc.publisher AMER INST PHYSICS -
dc.title Thermal conductivity of bulk and thin-film silicon: A Landauer approach -
dc.type Article -
dc.description.isOpenAccess FALSE -
dc.relation.journalWebOfScienceCategory Physics, Applied -
dc.relation.journalResearchArea Physics -
dc.type.docType Article -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.subject.keywordPlus SCATTERING -
dc.subject.keywordPlus LAYERS -
dc.subject.keywordPlus MODEL -
dc.subject.keywordPlus HEAT -

qrcode

Items in Repository are protected by copyright, with all rights reserved, unless otherwise indicated.