Full metadata record
DC Field | Value | Language |
---|---|---|
dc.citation.startPage | 103269 | - |
dc.citation.title | COMPUTER-AIDED DESIGN | - |
dc.citation.volume | 149 | - |
dc.contributor.author | Seong, Rak-Kyeong | - |
dc.contributor.author | Yang, Jaeho | - |
dc.contributor.author | Han, Sang-Hoon | - |
dc.date.accessioned | 2023-12-21T13:48:50Z | - |
dc.date.available | 2023-12-21T13:48:50Z | - |
dc.date.created | 2022-04-19 | - |
dc.date.issued | 2022-08 | - |
dc.description.abstract | In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of the layers of the package substrate in order to simplify the routing problem into a problem of connecting points on a circle with non-intersecting straight line segments. The circle, which we call the Circular Frame, is a polygonal schema, which is originally used in topology to study the topological structure of 2-manifolds. We show through experiments that our new routing method based on the Circular Frame competes with certain grid-based routing algorithms. | - |
dc.identifier.bibliographicCitation | COMPUTER-AIDED DESIGN, v.149, pp.103269 | - |
dc.identifier.doi | 10.1016/j.cad.2022.103269 | - |
dc.identifier.issn | 0010-4485 | - |
dc.identifier.scopusid | 2-s2.0-85130107050 | - |
dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/58291 | - |
dc.identifier.wosid | 000831263800004 | - |
dc.language | 영어 | - |
dc.publisher | Pergamon Press Ltd. | - |
dc.title | Topology for Substrate Routing in Semiconductor Package Design | - |
dc.type | Article | - |
dc.description.isOpenAccess | TRUE | - |
dc.relation.journalWebOfScienceCategory | Computer Science, Software Engineering | - |
dc.relation.journalResearchArea | Computer Science | - |
dc.type.docType | Article | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.subject.keywordAuthor | Substrate routing | - |
dc.subject.keywordAuthor | Geometric topology | - |
dc.subject.keywordAuthor | Semiconductor package design | - |
dc.subject.keywordPlus | ALGORITHM | - |
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