A Proposed On-Die Oscilloscope for Monitoring of Power Noise Waveform Inside IC Due to Transient Stress Events

Abstract

An on-die oscilloscope circuit is proposed to monitor the power noise waveforms inside IC due to the transient stress events for a more complete analysis of the effects of the transient stress events on the electronic systems. When the transient stress event occurs, the induced noise voltage waveform in the power supply is sampled and converted to digital data in real time. A trigger signal created by the event detector circuit is used to hold the digital data. The stored digital data inside the on-die oscilloscope are reconstructed back to the analog noise waveform based on the sampling process. The operation of each circuit block in the on-die oscilloscope is analyzed and validated by simulation and measurement results. The approximate bandwidth of the proposed on-die oscilloscope is extracted from simulation results. The power noise waveforms due to the transmission line pulse events and electrostatic discharge events are measured with an external oscilloscope instrument using cables and directly sampled and reconstructed by the on-die oscilloscope, and these measured and reconstructed analog noise waveforms are compared with each other.