BROWSE

Related Researcher

Author's Photo

Kim, Gun-Ho
SoftHeat Group
Research Interests
  • Heat transfer mechanism in soft materials (e.g., plastics, animal tissues)
  • Development of thermally conductive plastics and high performance polymeric thermoelectric heat engine
  • Development of biomedical devices that use responses of animals to environmental temperature changes

ITEM VIEW & DOWNLOAD

Enhanced Thermal Transport across Self-Interfacing van der Waals Contacts in Flexible Thermal Devices

DC Field Value Language
dc.contributor.author Seong, Minho ko
dc.contributor.author Hwang, Insol ko
dc.contributor.author Park, Seongjin ko
dc.contributor.author Jang, Hyejin ko
dc.contributor.author Choi, Geonjun ko
dc.contributor.author Kim, Jaeil ko
dc.contributor.author Kim, Shin-Kwan ko
dc.contributor.author Kim, Gun-Ho ko
dc.contributor.author Yeo, Junyeob ko
dc.contributor.author Jeong, Hoon Eui ko
dc.date.available 2021-08-26T07:43:51Z -
dc.date.created 2021-08-24 ko
dc.date.issued 2021-11 ko
dc.identifier.citation ADVANCED FUNCTIONAL MATERIALS, v.31, no.48, pp.2107023 ko
dc.identifier.issn 1616-301X ko
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/53535 -
dc.description.abstract Minimizing the thermal contact resistance (TCR) at the boundary between two bodies in contact is critical in diverse thermal transport devices. Conventional thermal contact methods have several limitations, such as high TCR, low interfacial adhesion, a requirement for high external pressure, and low optical transparency. Here, a self-interfacing flexible thermal device (STD) that can form robust van der Waals mechanical contact and low-resistant thermal contact to planar and non-planar substrates without the need for external pressure or surface modification is presented. The device is based on a distinctive integration of a bioinspired adhesive architecture and a thermal transport layer formed from percolating silver nanowire (AgNW) networks. The proposed device exhibits a strong attachment (maximum 538.9 kPa) to target substrates while facilitating thermal transport across the contact interface with low TCR (0.012 m(2) K kW(-1)) without the use of external pressure, thermal interfacial materials, or surface chemistries. ko
dc.language 영어 ko
dc.publisher WILEY-V C H VERLAG GMBH ko
dc.title Enhanced Thermal Transport across Self-Interfacing van der Waals Contacts in Flexible Thermal Devices ko
dc.type ARTICLE ko
dc.identifier.scopusid 2-s2.0-85114012983 ko
dc.identifier.wosid 000691899900001 ko
dc.type.rims ART ko
dc.identifier.doi 10.1002/adfm.202107023 ko
dc.identifier.url https://onlinelibrary.wiley.com/doi/10.1002/adfm.202107023 ko
Appears in Collections:
MEN_Journal Papers

find_unist can give you direct access to the published full text of this article. (UNISTARs only)

Show simple item record

qrcode

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

MENU