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- Kim, Jingook
- Integrated Circuit and Electromagnetic Compatibility Lab.
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | KO | - |
| dc.citation.title | Asia-Pacific Symposium on Electromagnetic Compatibility | - |
| dc.contributor.author | Kim, Jingook | - |
| dc.date.accessioned | 2023-12-20T03:06:51Z | - |
| dc.date.available | 2023-12-20T03:06:51Z | - |
| dc.date.created | 2015-07-01 | - |
| dc.date.issued | 2011-05-10 | - |
| dc.identifier.bibliographicCitation | Asia-Pacific Symposium on Electromagnetic Compatibility | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/51572 | - |
| dc.publisher | IEEE | - |
| dc.title | The Effects of substrate doping density on the electrical performance of Through-Silicon-Via (TSV) | - |
| dc.type | Conference Paper | - |
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