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Lee, Zonghoon
Atomic-Scale Electron Microscopy Lab.
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dc.citation.endPage 1481 -
dc.citation.number 7 -
dc.citation.startPage 1473 -
dc.citation.title METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE -
dc.citation.volume 34A -
dc.contributor.author Lee, Zonghoon -
dc.contributor.author Rodriguez, R -
dc.contributor.author Hayes, RW -
dc.contributor.author Lavernia, EJ -
dc.contributor.author Nutt, SR -
dc.date.accessioned 2023-12-22T11:11:01Z -
dc.date.available 2023-12-22T11:11:01Z -
dc.date.created 2014-06-23 -
dc.date.issued 2003-07 -
dc.description.abstract The microstructural evolution during processing and tensile deformation of a nanocrystalline Al-Ti-Cu alloy was investigated using transmission and scanning electron microscopy. Grain refinement was achieved by cryomilling of elemental powders, and powders were consolidated by hot isostatic pressing ("HIPing") followed by extrusion to produce bulk nanocrystalline Al-Ti-Cu alloys. In an effort to enhance ductility and toughness of nanocrystalline metals, multiscale structures were produced that consisted of nanocrystalline grains and elongated coarse-grain (CG) bands of pure aluminum. Examination of bulk tensile fracture samples revealed unusual failure mechanisms and interactions between the CG bands and nanocrystalline regions. The ductile CG bands underwent extensive plastic deformation prior to fracture, while nanocrystalline regions exhibited nucleation and growth of voids and microcracks. Cracks tended to propagate from nanocrystalline regions to the CG bands, where they were effectively arrested by a combination of crack blunting and crack bridging. These processes were instrumental in enhancing the toughness and ductility of the nanocrystalline alloy. -
dc.identifier.bibliographicCitation METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.34A, no.7, pp.1473 - 1481 -
dc.identifier.doi 10.1007/s11661-003-0259-x -
dc.identifier.issn 1073-5623 -
dc.identifier.scopusid 2-s2.0-0042697290 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/5034 -
dc.identifier.url http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=0042697290 -
dc.identifier.wosid 000184051100007 -
dc.language 영어 -
dc.publisher SPRINGER -
dc.title Microstructural evolution and deformation of cryomilled nanocrystalline Al-Ti-Cu alloy -
dc.type Article -
dc.description.journalRegisteredClass scopus -

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