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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | US | - |
| dc.citation.conferencePlace | San Diego, USA | - |
| dc.citation.title | IEEE SLIP | - |
| dc.contributor.author | Kim, Youngmin | - |
| dc.date.accessioned | 2023-12-20T03:09:10Z | - |
| dc.date.available | 2023-12-20T03:09:10Z | - |
| dc.date.created | 2013-07-17 | - |
| dc.date.issued | 2011 | - |
| dc.identifier.bibliographicCitation | IEEE SLIP | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/46208 | - |
| dc.language | 영어 | - |
| dc.publisher | IEEE | - |
| dc.title | Performance and Power Analysis of Through Silicon Vias based 3D ICs Integration | - |
| dc.type | Conference Paper | - |
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