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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | KO | - |
| dc.citation.conferencePlace | 서울시립대학교 | - |
| dc.citation.title | 한국마이크로 전자패키징학회 | - |
| dc.contributor.author | Kwon, Daeil | - |
| dc.date.accessioned | 2023-12-20T01:36:44Z | - |
| dc.date.available | 2023-12-20T01:36:44Z | - |
| dc.date.created | 2014-01-08 | - |
| dc.date.issued | 2013 | - |
| dc.identifier.bibliographicCitation | 한국마이크로 전자패키징학회 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/45733 | - |
| dc.language | 한국어 | - |
| dc.publisher | 한국마이크로 전자패키징학회 | - |
| dc.title | Improved Reliability Prediction Methodology for Electronic Packages Using RF Impedance Analysis | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2013 | - |
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