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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | JA | - |
| dc.citation.conferencePlace | Kyoto | - |
| dc.citation.title | International Conference on Electronics Packaging | - |
| dc.contributor.author | Kwon, Daeil | - |
| dc.date.accessioned | 2023-12-19T22:38:31Z | - |
| dc.date.available | 2023-12-19T22:38:31Z | - |
| dc.date.created | 2015-07-16 | - |
| dc.date.issued | 2015-04-16 | - |
| dc.identifier.bibliographicCitation | International Conference on Electronics Packaging | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/44824 | - |
| dc.language | 영어 | - |
| dc.publisher | IEEE CPMT Society | - |
| dc.title | Prognostics of Solder Joint Reliability Based on Impedance Analysis and Particle Filtering | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2015-04-14 | - |
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