Fabrication of High-resolution Bridge-like 3D Interconnects using Electrohydrohynamic Inkjet Printing

Abstract

As electronics are moving toward highly integrated and complex hierarchical forms, the development of high-resolution packaging and metallization technologies becomes an important research topic. Conventional techniques, however, still present challenges in providing high-resolution features or reducing multiple process steps. Here, we demonstrate the direct fabrication of high-resolution bridge-like 3D interconnects using electrohydrodynamic inkjet (e-jet) printing technology. E-jet printing, which can use small nozzles to reduce droplet sizes by exploiting an electric field for ejectin