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- Byon, Chan
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | KO | - |
| dc.citation.title | 3rd International Conference on Materials and Reliability (ICMR) | - |
| dc.contributor.author | Ngo, Ich-Long | - |
| dc.contributor.author | Jeon, Sangwoo | - |
| dc.contributor.author | Byon, Chan | - |
| dc.date.accessioned | 2023-12-19T21:36:13Z | - |
| dc.date.available | 2023-12-19T21:36:13Z | - |
| dc.date.created | 2017-10-20 | - |
| dc.date.issued | 2015-11-23 | - |
| dc.identifier.bibliographicCitation | 3rd International Conference on Materials and Reliability (ICMR) | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/39432 | - |
| dc.language | 영어 | - |
| dc.publisher | Korean Society for Mechanical Engineers (KSME) | - |
| dc.title | Stress analysis for diffusion bonding process of PCHE type heat exchanger | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2015-11-23 | - |
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