dc.citation.conferencePlace |
US |
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dc.citation.title |
2013 IEEE International Reliability Physics Symposium (IRPS) |
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dc.contributor.author |
Rangaraj, Sudarshan |
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dc.contributor.author |
Kwon, Daeil |
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dc.contributor.author |
Pei, Min |
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dc.contributor.author |
Hicks, Jeffrey |
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dc.contributor.author |
Leatherman, G |
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dc.contributor.author |
Lucero, Alan |
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dc.contributor.author |
Wilson, Terri |
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dc.contributor.author |
Streit, Sarah |
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dc.contributor.author |
He, Jun |
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dc.date.accessioned |
2023-12-20T01:07:43Z |
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dc.date.available |
2023-12-20T01:07:43Z |
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dc.date.created |
2013-10-11 |
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dc.date.issued |
2013-04-14 |
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dc.description.abstract |
IC components are exposed to moisture and thermal cycles during chip-package-board assembly and in their end use conditions. Moisture exposure influences the mechanical integrity of silicon backend dielectrics, assembly/packaging materials and packages. Reliability performance under accelerated stresses that simulate use conditions are often a critical factor in choice of materials, processing options and design rules. A complete assessment of the cumulative environmental exposure from chip-package assembly, shipment/storage, board system assembly, through end-customer use is required to guarantee product performance and reliability. This paper will detail these end user environments and use failure mode/mechanism specific acceleration models to develop accurate accelerated life testing plans and requirements. These requirements will then be compared to JEDEC standards based requirements and a need for re-calibration of these standards to more appropriate temperatures and stress durations will be highlighted. |
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dc.identifier.bibliographicCitation |
2013 IEEE International Reliability Physics Symposium (IRPS) |
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dc.identifier.doi |
10.1109/IRPS.2013.6532032 |
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dc.identifier.uri |
https://scholarworks.unist.ac.kr/handle/201301/37934 |
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dc.identifier.url |
https://ieeexplore.ieee.org/document/6532032/ |
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dc.language |
영어 |
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dc.publisher |
IEEE |
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dc.title |
Accelerated Stress Testing Methodology to Risk Assess Silicon-Package Thermo-Mechanical Failure Modes Resulting from Moisture Exposure under Use Conditions |
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dc.type |
Conference Paper |
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dc.date.conferenceDate |
2013-04-14 |
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