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- Kim, Jingook
- Integrated Circuit and Electromagnetic Compatibility Lab.
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | SI | - |
| dc.citation.title | International Conference on Advances in Packaging | - |
| dc.contributor.author | Kim, Jingook | - |
| dc.date.accessioned | 2023-12-20T06:10:02Z | - |
| dc.date.available | 2023-12-20T06:10:02Z | - |
| dc.date.created | 2013-07-17 | - |
| dc.date.issued | 2001-12-05 | - |
| dc.identifier.bibliographicCitation | International Conference on Advances in Packaging | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/35852 | - |
| dc.language | 영어 | - |
| dc.publisher | APACK | - |
| dc.title | microwave frequency dielectric constant and loss tangent measurements of PCB materials using stripline structure | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2001-12-05 | - |
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