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- Kim, Jingook
- Integrated Circuit and Electromagnetic Compatibility Lab.
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | IT | - |
| dc.citation.conferencePlace | Pisa | - |
| dc.citation.endPage | 26 | - |
| dc.citation.startPage | 23 | - |
| dc.citation.title | 6th IEEE Workshop on Signal Propagation on Interconnects, SPI | - |
| dc.contributor.author | Kim, Jingook | - |
| dc.contributor.author | Kim, Hyungsoo | - |
| dc.contributor.author | Jeong, Youchul | - |
| dc.contributor.author | Lee, Junho | - |
| dc.contributor.author | Kim, Joungho | - |
| dc.date.accessioned | 2023-12-20T06:09:02Z | - |
| dc.date.available | 2023-12-20T06:09:02Z | - |
| dc.date.created | 2013-07-17 | - |
| dc.date.issued | 2002-05-12 | - |
| dc.description.abstract | In the design of high-speed multi-layer board, the partitioning of the power/ground plane breaks return path of the signal current through either power plane or ground plane, which causes unwanted side effects such as reflection, crosstalk and radiation. In this paper, we have analyzed the effects of split power/ground plane on signal integrity experimentally and numerically. We have proposed equivalent circuit model of the signal traces crossing the ground slot, based on slot transmission line model. The reflection, transmission and crosstalk waveforms can be simulated and explained rigorously using the proposed model, regardless of the type of slot end. | - |
| dc.identifier.bibliographicCitation | 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.23 - 26 | - |
| dc.identifier.doi | 10.1109/SPI.2002.258281 | - |
| dc.identifier.scopusid | 2-s2.0-28444478584 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/35849 | - |
| dc.identifier.url | https://ieeexplore.ieee.org/document/4027646 | - |
| dc.language | 영어 | - |
| dc.publisher | 6th IEEE Workshop on Signal Propagation on Interconnects, SPI | - |
| dc.title | Slot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2002-05-12 | - |
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