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- Kim, Jingook
- Integrated Circuit and Electromagnetic Compatibility Lab.
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | SI | - |
| dc.citation.title | IEEE 5th Electronics Packaging Technology Conference | - |
| dc.contributor.author | Kim, Jingook | - |
| dc.contributor.author | Rotaru, Mihai Dragos | - |
| dc.contributor.author | Lee, Junwoo | - |
| dc.contributor.author | Park, Jongbae | - |
| dc.contributor.author | Alexander, Popov | - |
| dc.contributor.author | Iyer, Mahadevan K. | - |
| dc.contributor.author | Kim, Joungho | - |
| dc.date.accessioned | 2023-12-20T06:06:04Z | - |
| dc.date.available | 2023-12-20T06:06:04Z | - |
| dc.date.created | 2013-07-17 | - |
| dc.date.issued | 2003-12-12 | - |
| dc.description.abstract | This paper presents an analytical model of power/ground noise coupling to signal traces in high-speed multi-layer systems. The coupling model is expressed in terms of transfer impedance which denotes the coupled noise voltage at the signal trace when switching current occurs. This model is then compared with measured data and full-wave simulated data up to 10 GHz to verify the validity of the model. The results calculated by the proposed model shows good correlation with measurement. | - |
| dc.identifier.bibliographicCitation | IEEE 5th Electronics Packaging Technology Conference | - |
| dc.identifier.doi | 10.1109/EPTC.2003.1271488 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/35840 | - |
| dc.identifier.url | https://ieeexplore.ieee.org/document/1271488 | - |
| dc.language | 영어 | - |
| dc.publisher | IEEE | - |
| dc.title | Analytical model of power/ground noise coupling to signal traces in high-speed multi-layer packages or boards | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2003-12-12 | - |
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