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김진국

Kim, Jingook
Integrated Circuit and Electromagnetic Compatibility Lab.
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dc.citation.conferencePlace US -
dc.citation.conferencePlace Portland, OR -
dc.citation.endPage 679 -
dc.citation.startPage 675 -
dc.citation.title ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems -
dc.contributor.author Kim, Jingook -
dc.contributor.author Drewniak, James -
dc.contributor.author Fan, Jun -
dc.date.accessioned 2023-12-20T03:06:08Z -
dc.date.available 2023-12-20T03:06:08Z -
dc.date.created 2013-07-17 -
dc.date.issued 2011-07-06 -
dc.description.abstract In this paper, a simple circuit model for IC multiple power and ground via arrays in a multilayer PCB is built based on the resonant cavity model. Using the circuit model, the parasitic inductance for the IC power and ground connection is quantitatively investigated according to via number and via patterns. The stack-up configuration of the power/ground plane pair is not critical for PDN performance in multilayer PCBs, as long as there are sufficient IC power/ground vias in an alternating pattern. The outcome of this work can be used to guide the pin-map design for high-speed packages. -
dc.identifier.bibliographicCitation ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, pp.675 - 679 -
dc.identifier.doi 10.1115/IPACK2011-52287 -
dc.identifier.scopusid 2-s2.0-84860323999 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/35736 -
dc.identifier.url http://proceedings.asmedigitalcollection.asme.org/proceeding.aspx?articleid=1630043 -
dc.language 영어 -
dc.publisher ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems -
dc.title Power/ground pin-map design for power integrity -
dc.type Conference Paper -
dc.date.conferenceDate 2011-07-06 -

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