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Lee, Kyuho Jason
Intelligent Systems Lab.
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A 1.22 TOPS and 1.52mW/MHz Augmented Reality Multi-Core Processor with Neural Network NoC for HMD Applications

Author(s)
Kim, GyeonghoonKim, YouchangLee, KyuhoPark, SeongwookHong, InjoonBong, KyeongryeolShin, DongjooChoi, SungpillOh, JinwookYoo, Hoi-Jun
Issued Date
2014-02-09
DOI
10.1109/ISSCC.2014.6757391
URI
https://scholarworks.unist.ac.kr/handle/201301/35603
Fulltext
https://ieeexplore.ieee.org/document/6757391/
Citation
IEEE International Solid-State Circuits Conference, pp.182 - 183
Abstract
Augmented reality (AR) is being investigated in advanced displays for the augmentation of images in a real-world environment. Wearable systems, such as head-mounted display (HMD) systems, have attempted to support real-time AR as a next generation UI/UX [1-2], but have failed, due to their limited computing power. In a prior work, a chip with limited AR functionality was reported that could perform AR with the help of markers placed in the environment (usually 1D or 2D bar codes) [3]. However, for a seamless visual experience, 3D objects should be rendered directly on the natural video image without any markers. Unlike marker-based AR, markerless AR requires natural feature extraction, general object recognition, 3D reconstruction, and camera-pose estimation to be performed in parallel. For instance, markerless AR for a VGA input-test video consumes ~1.3W power at 0.2fps throughput, with TI's OMAP4430, which exceeds power limits for wearable devices. Consequently, there is a need for a high-performance energy-efficient markerless AR processor to realize a real-time AR system, especially for HMD applications.
Publisher
2014 61st IEEE International Solid-State Circuits Conference, ISSCC 2014
ISSN
0193-6530

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