dc.citation.conferencePlace |
KO |
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dc.citation.conferencePlace |
Seoul |
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dc.citation.title |
2015 IEEE Electrical Design of Advanced Packaging & Systems Symposium |
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dc.contributor.author |
Park, Junsik |
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dc.contributor.author |
Lee, Jongsung |
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dc.contributor.author |
Kim, Seongmoo |
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dc.contributor.author |
Seol, Byongsu |
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dc.contributor.author |
Kim, Jingook |
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dc.date.accessioned |
2023-12-19T21:10:50Z |
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dc.date.available |
2023-12-19T21:10:50Z |
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dc.date.created |
2016-01-11 |
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dc.date.issued |
2015-12-15 |
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dc.description.abstract |
The system-level ESD coupling on a microstrip line is calculated using the partial element equivalent circuit (PEEC) method both in frequency and time domains. A simplified MNA matrix for the victim trace is proposed to quickly calculate the charge and current induced due to the ESD event. The calculated coupling transfer impedance and the ESD waveforms coupled on the traces are validated by comparison with measurements both in frequency and time domains. |
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dc.identifier.bibliographicCitation |
2015 IEEE Electrical Design of Advanced Packaging & Systems Symposium |
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dc.identifier.doi |
10.1109/EDAPS.2015.7383685 |
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dc.identifier.scopusid |
2-s2.0-84963811971 |
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dc.identifier.uri |
https://scholarworks.unist.ac.kr/handle/201301/35447 |
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dc.identifier.url |
http://ieeexplore.ieee.org/document/7383685/ |
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dc.language |
영어 |
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dc.publisher |
IEEE |
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dc.title |
Fast Calculation of System-Level ESD Noise Coupling to a Microstrip Line Using PEEC Method |
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dc.type |
Conference Paper |
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dc.date.conferenceDate |
2015-12-14 |
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