Detailed Information
Cited time in 
Cited time in 
Cited time in
Metadata Downloads
Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | US | - |
| dc.citation.conferencePlace | Hotel Hilton Miami Downtown1601 Biscayne BlvdMiam | - |
| dc.citation.title | 17th Biennial IEEE Conference on Electromagnetic Field Computation, IEEE CEFC 2016 | - |
| dc.contributor.author | Han, Ki Jin | - |
| dc.contributor.author | Swaminathan, Madhavan | - |
| dc.date.accessioned | 2023-12-19T19:38:53Z | - |
| dc.date.available | 2023-12-19T19:38:53Z | - |
| dc.date.created | 2017-01-12 | - |
| dc.date.issued | 2016-11-15 | - |
| dc.description.abstract | For the electrical modeling of electronic packaging composed of planar and vertical interconnections, this paper presents the combination of two integral equation based circuit extraction methods. Each method, which geometrically accords with planar or cylindrical structures, can generate equivalent circuit elements separately. The planar and cylindrical interconnection models are connected in circuit level, and the coupling between the two models can be considered by additional capacitive components. | - |
| dc.identifier.bibliographicCitation | 17th Biennial IEEE Conference on Electromagnetic Field Computation, IEEE CEFC 2016 | - |
| dc.identifier.doi | 10.1109/CEFC.2016.7816187 | - |
| dc.identifier.scopusid | 2-s2.0-85011965375 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/35353 | - |
| dc.identifier.url | https://ieeexplore.ieee.org/document/7816187 | - |
| dc.language | 영어 | - |
| dc.publisher | 17th Biennial IEEE Conference on Electromagnetic Field Computation, IEEE CEFC 2016 | - |
| dc.title | Combined Integral Equation Based Circuit Modeling of Interconnections in Electronic Packaging | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2016-11-13 | - |
Items in Repository are protected by copyright, with all rights reserved, unless otherwise indicated.