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- Bien, Franklin
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | KO | - |
| dc.citation.conferencePlace | Jeju | - |
| dc.citation.endPage | 322 | - |
| dc.citation.startPage | 321 | - |
| dc.citation.title | 23rd Asia and South Pacific Design Automation Conference, ASP-DAC 2018 | - |
| dc.contributor.author | Park, Kyeong-min | - |
| dc.contributor.author | Song, Joo-hyeb | - |
| dc.contributor.author | Bien, Franklin | - |
| dc.date.accessioned | 2023-12-19T17:37:46Z | - |
| dc.date.available | 2023-12-19T17:37:46Z | - |
| dc.date.created | 2018-06-12 | - |
| dc.date.issued | 2018-01-22 | - |
| dc.description.abstract | This paper presents a highly sensitive fingerprint readout IC for glass-covered mutual capacitive fingerprint sensor. To enhance signal to noise ratio (SNR) from the relatively loud noises compared to the signal, the proposed fingerprint readout IC uses modulation and demodulation process, band-pass operation and differential sensing scheme. Furthermore, the proposed fingerprint readout IC make an interface with 250 dpi glass-covered mutual capacitive fingerprint sensor which is patterned with 42 transmitter (TX) electrodes and 32 receiver (RX) electrodes. An analog front end (AFE) achieves 42 dB SNR under 0.1 T (mm) cover glass and 38 dB SNR under 0.2 T (mm) cover glass. The test chip fabricated with 0.18 μm CMOS process consumes 28 mW from a 3.3 V supply. | - |
| dc.identifier.bibliographicCitation | 23rd Asia and South Pacific Design Automation Conference, ASP-DAC 2018, pp.321 - 322 | - |
| dc.identifier.doi | 10.1109/ASPDAC.2018.8297340 | - |
| dc.identifier.scopusid | 2-s2.0-85045313184 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/35226 | - |
| dc.identifier.url | https://ieeexplore.ieee.org/document/8297340/ | - |
| dc.language | 영어 | - |
| dc.publisher | IEEE | - |
| dc.title | Highly sensitive fingerprint readout IC for glass-covered mutual capacitive fingerprint sensor | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2018-01-22 | - |
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