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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | SI | - |
| dc.citation.title | 60th IEEE International Symposium on Electromagnetic Compatibility and 9th IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018 | - |
| dc.contributor.author | Lee, Bonyoung | - |
| dc.contributor.author | Park, Woojin | - |
| dc.contributor.author | Song, Seongkyu | - |
| dc.contributor.author | Bien, Franklin | - |
| dc.date.accessioned | 2023-12-19T15:50:33Z | - |
| dc.date.available | 2023-12-19T15:50:33Z | - |
| dc.date.created | 2018-11-21 | - |
| dc.date.issued | 2018-05-14 | - |
| dc.description.abstract | Using layers of mesh shaped and flat copper plate, this paper demonstrates single metal path power transfer system without return path through the surface of aluminum foil at 13.56MHz. Transceivers are isolated from the energy propagating medium but surface wave gets excited. This technology is free from co-alignment limitation between Tx and Rx, enabling free position of Rx with given metal plate environment. Around 20% power transfer efficiency was achieved with a LC matching network part. | - |
| dc.identifier.bibliographicCitation | 60th IEEE International Symposium on Electromagnetic Compatibility and 9th IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018 | - |
| dc.identifier.doi | 10.1109/ISEMC.2018.8394046 | - |
| dc.identifier.scopusid | 2-s2.0-85050136433 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/35208 | - |
| dc.identifier.url | https://ieeexplore.ieee.org/document/8394046 | - |
| dc.language | 영어 | - |
| dc.publisher | IEEE | - |
| dc.title | Single metal path power transfer technology without return path at 13.56MHz ISM band | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2018-05-14 | - |
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