dc.citation.conferencePlace |
US |
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dc.citation.conferencePlace |
Portland, OR |
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dc.citation.endPage |
112 |
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dc.citation.startPage |
109 |
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dc.citation.title |
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems |
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dc.contributor.author |
Kim, Jingook |
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dc.contributor.author |
Kim, Jaemin |
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dc.contributor.author |
Ren, Liehui |
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dc.contributor.author |
Fan, Jun |
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dc.contributor.author |
Kim, Joungho |
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dc.contributor.author |
Drewniak, James L. |
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dc.date.accessioned |
2023-12-20T04:06:43Z |
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dc.date.available |
2023-12-20T04:06:43Z |
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dc.date.created |
2013-07-17 |
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dc.date.issued |
2009-10-19 |
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dc.description.abstract |
A method to calculate equivalent inductances of multiple vias in arrays has been proposed. The method has been applied to the modeling of a hierarchical power bus and validated by measurements. It is accurate at the frequencies lower than the cavity resonant frequencies. |
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dc.identifier.bibliographicCitation |
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, pp.109 - 112 |
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dc.identifier.doi |
10.1109/EPEPS.2009.5338464 |
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dc.identifier.scopusid |
2-s2.0-74549162174 |
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dc.identifier.uri |
https://scholarworks.unist.ac.kr/handle/201301/34810 |
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dc.identifier.url |
https://ieeexplore.ieee.org/document/5338464 |
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dc.language |
영어 |
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dc.publisher |
IEEE |
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dc.title |
Extraction of equivalent inductance in package-PCB hierarchical power distribution network |
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dc.type |
Conference Paper |
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dc.date.conferenceDate |
2009-10-19 |
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