dc.citation.conferencePlace |
GE |
- |
dc.citation.endPage |
888 |
- |
dc.citation.startPage |
885 |
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dc.citation.title |
2018 Design, Automation & Test in Europe Conference & Exhibition (DATE) |
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dc.contributor.author |
Kim, Seungwon |
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dc.contributor.author |
Han, Ki Jin |
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dc.contributor.author |
Kim, Youngmin |
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dc.contributor.author |
Kang, Seokhyeong |
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dc.date.accessioned |
2023-12-19T17:36:40Z |
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dc.date.available |
2023-12-19T17:36:40Z |
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dc.date.created |
2019-02-28 |
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dc.date.issued |
2018-03-19 |
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dc.description.abstract |
The power integrity of high-speed interfaces is an increasingly important issue in mobile memory systems. However, because of complicated design variations such as adjacent VDD domain coupling, conventional case-specific modeling is limited in analyzing trends in results from parametric variations. Moreover, conventional industrial methods can be simulated only after the design layout is completed and it requires a lot of back-annotation processes, which result in delayed delays time to market. In this paper, we propose a chip-package-PCB coanalysis methodology applied to our multi-domain high-speed memory system model with a current generation method. Our proposed parametric simulation model can analyze the tendency of power integrity results from variable sweeps and Monte Carlo simulations, and it shows a significantly reduced runtime compared to the conventional EDA methodology under JEDEC LPPDR4 environment. |
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dc.identifier.bibliographicCitation |
2018 Design, Automation & Test in Europe Conference & Exhibition (DATE), pp.885 - 888 |
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dc.identifier.doi |
10.23919/DATE.2018.8342132 |
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dc.identifier.scopusid |
2-s2.0-85048755022 |
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dc.identifier.uri |
https://scholarworks.unist.ac.kr/handle/201301/34789 |
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dc.identifier.url |
https://ieeexplore.ieee.org/document/8342132 |
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dc.language |
영어 |
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dc.publisher |
DATE 2018 |
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dc.title |
Fast chip-package-PCB coanalysis methodology for power integrity of multi-domain high-speed memory: A case study |
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dc.type |
Conference Paper |
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dc.date.conferenceDate |
2018-03-19 |
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