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Jeong, Hoon Eui
Multiscale Biomimetics & Manufacturing Lab
Research Interests
  • Biomimetics
  • Multiscale manufacturing
  • Micro/nanofabrication

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Enhanced Directional Adhesion Behavior of Mushroom-Shaped Microline Arrays

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dc.contributor.author Kim, Jeong Hun ko
dc.contributor.author Jeong, Hoon Eui ko
dc.contributor.author Kim, Sang Moon ko
dc.contributor.author Kang, Seong Min ko
dc.date.available 2019-09-16T08:08:42Z -
dc.date.created 2019-09-06 ko
dc.date.issued 2020-01 ko
dc.identifier.citation INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING-GREEN TECHNOLOGY, v.7, pp.239 - 245 ko
dc.identifier.issn 2288-6206 ko
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/27430 -
dc.description.abstract We report directional switchable adhesion behavior inspired by the locomotion mechanism of gecko lizard. The robust mushroom-like polydimethylsiloxane microline arrays are fabricated by using silicon based over-etching process and replica molding. The line gecko patterns attached to the glass substrate exhibit strong shear adhesion forces in parallel and perpendicular directions with respect to the line direction and high adhesion hysteresis property only in the parallel direction. We have explained the directional adhesion behavior of the line gecko pattern by comparing peeling propagation and normal adhesion phenomenon. Then, we have successfully demonstrated silicon wafer transportation with the line gecko pattern by using directional adhesion behavior of the pattern, which is high shear adhesion force and low peeling force in the parallel direction with respect to the line direction. ko
dc.language 영어 ko
dc.publisher KOREAN SOC PRECISION ENG ko
dc.title Enhanced Directional Adhesion Behavior of Mushroom-Shaped Microline Arrays ko
dc.type ARTICLE ko
dc.identifier.scopusid 2-s2.0-85077343708 ko
dc.identifier.wosid 000511689700020 ko
dc.type.rims ART ko
dc.identifier.doi 10.1007/s40684-019-00112-6 ko
dc.identifier.url https://link.springer.com/article/10.1007%2Fs40684-019-00112-6 ko
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