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정홍식

Jeong, Hongsik
Future Semiconductor Technology Lab.
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dc.citation.endPage 2853 -
dc.citation.number 5 -
dc.citation.startPage 2851 -
dc.citation.title IEEE TRANSACTIONS ON MAGNETICS -
dc.citation.volume 39 -
dc.contributor.author Kim, H.J. -
dc.contributor.author Jeong, W.C. -
dc.contributor.author Koh, K.H. -
dc.contributor.author Jeong, G.T. -
dc.contributor.author Park, J.H. -
dc.contributor.author Lee, S.Y. -
dc.contributor.author Oh, J.H. -
dc.contributor.author Song, I.H. -
dc.contributor.author Jeong, H.S. -
dc.contributor.author Kim, K. -
dc.date.accessioned 2023-12-22T11:09:19Z -
dc.date.available 2023-12-22T11:09:19Z -
dc.date.created 2019-07-11 -
dc.date.issued 2003-09 -
dc.description.abstract We have demonstrated fully integrated 64-kb magnetoresistive random access memory (MRAM) using 0.24-mum CMOS technology and discussed some key issues in process integration. Optimal tunneling magnetoresistive (TMR) properties of MRAM bits (37% of TMR ratio and 5-10 kOmega.mum(2) of RA) were obtained mainly by the control of bottom electrode roughness, and electrical shorting was avoided by some commercialized wet solutions. In viewpoint of process integration, excellent TMR properties of magnetic tunnel junction (MTJ) fresh films and prevention of their degradation in post patterning process are two crucial factors, and especially, electrical shorting requires some careful control. -
dc.identifier.bibliographicCitation IEEE TRANSACTIONS ON MAGNETICS, v.39, no.5, pp.2851 - 2853 -
dc.identifier.doi 10.1109/TMAG.2003.816243 -
dc.identifier.issn 0018-9464 -
dc.identifier.scopusid 2-s2.0-0141953085 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/27116 -
dc.identifier.url https://ieeexplore.ieee.org/document/1233237 -
dc.identifier.wosid 000185722100207 -
dc.language 영어 -
dc.publisher IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC -
dc.title A process integration of high-performance 64-kb MRAM -
dc.type Article -
dc.description.isOpenAccess FALSE -
dc.relation.journalWebOfScienceCategory Engineering, Electrical & Electronic; Physics, Applied -
dc.relation.journalResearchArea Engineering; Physics -
dc.type.docType Article; Proceedings Paper -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.subject.keywordAuthor magnetic tunnel junction (MTJ) -
dc.subject.keywordAuthor magnetoresistive random access memory (MRAM) -
dc.subject.keywordAuthor process integration -
dc.subject.keywordAuthor shorting failure -

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