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- Kim, Jingook
- Integrated Circuit and Electromagnetic Compatibility Lab.
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.endPage | 290 | - |
| dc.citation.number | 2 | - |
| dc.citation.startPage | 285 | - |
| dc.citation.title | IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | - |
| dc.citation.volume | 62 | - |
| dc.contributor.author | Park, Junsik | - |
| dc.contributor.author | Lee, Jongsung | - |
| dc.contributor.author | Jo, Cheolgu | - |
| dc.contributor.author | Seol, Byongsu | - |
| dc.contributor.author | Kim, Jingook | - |
| dc.date.accessioned | 2023-12-21T18:08:17Z | - |
| dc.date.available | 2023-12-21T18:08:17Z | - |
| dc.date.created | 2019-03-05 | - |
| dc.date.issued | 2020-02 | - |
| dc.description.abstract | A structure embedded in a printed circuit board is proposed to control secondary discharge currents and improve the system-level electrostatic discharge (ESD) immunity for a mobile product with a metal frame. Noise voltages and discharge currents were measured and analyzed according to several secondary discharge paths, such as an air arc, a voltage suppressor device, and with the interlaced suppression device. ESD events that caused soft failures of a real commercial mobile product were tested while a high-definition video was playing. System-level ESD-induced noise and soft failures were cost effectively reduced by the interlaced suppression device. | - |
| dc.identifier.bibliographicCitation | IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.62, no.2, pp.285 - 290 | - |
| dc.identifier.doi | 10.1109/TEMC.2018.2875136 | - |
| dc.identifier.issn | 0018-9375 | - |
| dc.identifier.scopusid | 2-s2.0-85055684241 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/26488 | - |
| dc.identifier.url | https://ieeexplore.ieee.org/document/8502788 | - |
| dc.identifier.wosid | 000521967400033 | - |
| dc.language | 영어 | - |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
| dc.title | A Cost-Effective Structure for Secondary Discharge Control to Improve System-Level ESD Immunity of a Mobile Product | - |
| dc.type | Article | - |
| dc.description.isOpenAccess | FALSE | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic; Telecommunications | - |
| dc.relation.journalResearchArea | Engineering; Telecommunications | - |
| dc.type.docType | Article | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.subject.keywordAuthor | Arc discharge | - |
| dc.subject.keywordAuthor | Voltage measurement | - |
| dc.subject.keywordAuthor | Electrostatic discharges | - |
| dc.subject.keywordAuthor | Discharges (electric) | - |
| dc.subject.keywordAuthor | Metals | - |
| dc.subject.keywordAuthor | Current measurement | - |
| dc.subject.keywordAuthor | Resistors | - |
| dc.subject.keywordAuthor | Noise measurement | - |
| dc.subject.keywordAuthor | cost effective | - |
| dc.subject.keywordAuthor | electrostatic discharge (ESD) | - |
| dc.subject.keywordAuthor | electromagnetic compatibility | - |
| dc.subject.keywordAuthor | immunity | - |
| dc.subject.keywordAuthor | interlaced pattern | - |
| dc.subject.keywordAuthor | secondary discharge | - |
| dc.subject.keywordAuthor | soft failure | - |
| dc.subject.keywordAuthor | system-level noise | - |
| dc.subject.keywordAuthor | voltage suppressor | - |
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