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Lee, Kyuho Jason
Intelligent Systems Lab.
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dc.citation.endPage 124 -
dc.citation.number 1 -
dc.citation.startPage 113 -
dc.citation.title IEEE JOURNAL OF SOLID-STATE CIRCUITS -
dc.citation.volume 50 -
dc.contributor.author Kim, Gyeonghoon -
dc.contributor.author Lee, Kyuho -
dc.contributor.author Kim, Youchang -
dc.contributor.author Park, Seongwook -
dc.contributor.author Hong, Injoon -
dc.contributor.author Bong, Kyeongryeol -
dc.contributor.author Yoo, Hoi-Jun -
dc.date.accessioned 2023-12-22T01:42:07Z -
dc.date.available 2023-12-22T01:42:07Z -
dc.date.created 2018-08-07 -
dc.date.issued 2015-01 -
dc.description.abstract Real-time augmented reality (AR) is actively studied for the future user interface and experience in high-performance head-mounted display (HMD) systems. The small battery size and limited computing power of the current HMD, however, fail to implement the real-time markerless AR in the HMD. In this paper, we propose a real-time and low-power AR processor for advanced 3D-AR HMD applications. For the high throughput, the processor adopts task-level pipelined SIMD-PE clusters and a congestion-aware network-on-chip (NoC). Both of these two features exploit the high data-level parallelism (DLP) and task-level parallelism (TLP) with the pipelined multicore architecture. For the low power consumption, it employs a vocabulary forest accelerator and a mixed-mode support vector machine (SVM)-based DVFS control to reduce unnecessary external memory accesses and core activation. The proposed 4 mm 8 mm HMD AR processor is fabricated using 65 nm CMOS technology for a battery-powered HMD platform with real-time AR operation. It consumes 381 mW average power and 778 mW peak power at 250 MHz operating frequency and 1.2 V supply voltage. It achieves 1.22 TOPS peak performance and 1.57 TOPS/W energy efficiency, which are, respectively, and higher than the state of the art. -
dc.identifier.bibliographicCitation IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.50, no.1, pp.113 - 124 -
dc.identifier.doi 10.1109/JSSC.2014.2352303 -
dc.identifier.issn 0018-9200 -
dc.identifier.scopusid 2-s2.0-84920144755 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/24531 -
dc.identifier.url https://ieeexplore.ieee.org/document/6899706/?arnumber=6899706 -
dc.identifier.wosid 000346972800010 -
dc.language 영어 -
dc.publisher IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC -
dc.title A 1.22 TOPS and 1.52 mW/MHz Augmented Reality Multicore Processor With Neural Network NoC for HMD Applications -
dc.type Article -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.subject.keywordAuthor Augmented reality (AR) -
dc.subject.keywordAuthor AR processor architecture -
dc.subject.keywordAuthor congestion-aware task assignment -
dc.subject.keywordAuthor heterogeneous SIMD multicore architecture -
dc.subject.keywordAuthor 2D-mesh network-on-chip -
dc.subject.keywordPlus OBJECT RECOGNITION -
dc.subject.keywordPlus ENGINE -

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