Topology Conversions of Non-Interpenetrated Metal-Organic Frameworks to Doubly Interpenetrated Metal-Organic Frameworks

Abstract

Non-interpenetrated three-dimensional (3D) metal-organic frameworks (MOFs) with both an interpenetration-favorable (3,5)-c hms topology and an interpenetration-unfavorable (3,5)-c gra topology are converted to doubly interpenetrated analogues with hmsc topology by thermal treatment, even in the absence of solvent. Depending on the conversion temperature and the properties of the pillaring ligand in the non-interpenetrated 3D MOF, which is based on two-dimensional sheets with 3-c hcb topology pillared by neutral ditopic linkers, the pillaring ligands in the interpenetrated MOFs produced are partially removed during the thermal conversions, leading to interpenetrated MOFs that simultaneously contain both micro- and mesopores.