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DC Field | Value | Language |
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dc.citation.endPage | 5084 | - |
dc.citation.number | 16 | - |
dc.citation.startPage | 5072 | - |
dc.citation.title | NANOSCALE | - |
dc.citation.volume | 9 | - |
dc.contributor.author | Jo, Yejin | - |
dc.contributor.author | Kim, Ju Young | - |
dc.contributor.author | Kim, So-Yun | - |
dc.contributor.author | Seo, Yeong-Hui | - |
dc.contributor.author | Jang, Kwang-Suk | - |
dc.contributor.author | Lee, Su Yeon | - |
dc.contributor.author | Jung, Sungmook | - |
dc.contributor.author | Ryu, Beyong-Hwan | - |
dc.contributor.author | Kim, Hyun-Suk | - |
dc.contributor.author | Park, Jang-Ung | - |
dc.contributor.author | Choi, Youngmin | - |
dc.contributor.author | Jeong, Sunho | - |
dc.date.accessioned | 2023-12-21T22:19:27Z | - |
dc.date.available | 2023-12-21T22:19:27Z | - |
dc.date.created | 2017-05-22 | - |
dc.date.issued | 2017-04 | - |
dc.description.abstract | The use of 3-dimensional (3D) printable conductive materials has gained significant attention for various applications because of their ability to form unconventional geometrical architectures that cannot be realized with traditional 2-dimensional printing techniques. To resolve the major requisites in printed electrodes for practical applications (including high conductivity, 3D printability, excellent adhesion, and low-temperature processability), we have designed a chemically-reinforced multi-dimensional filler system comprising aminefunctionalized carbon nanotubes, carboxyl-terminated silver nanoparticles, and Ag flakes, with the incorporation of a thermoplastic polystyrene-polyisoprene-polystyrene (SIS) triblock copolymer. It is demonstrated that both high conductivity, 22 939 S cm(-1), and low-temperature processability, below 80 degrees C, are achievable with the introduction of chemically anchored carbon-to-metal hybrids and suggested that the highly viscous composite fluids employing the characteristic thermoplastic polymer are readily available for the fabrication of various unconventional electrode structures by a simple dispensing technique. The practical applicability of the 3D-printable highly conductive composite paste is confirmed with the successful fabrication of wireless power transmission modules on substrates with extremely uneven surface morphologies. | - |
dc.identifier.bibliographicCitation | NANOSCALE, v.9, no.16, pp.5072 - 5084 | - |
dc.identifier.doi | 10.1039/c6nr09610g | - |
dc.identifier.issn | 2040-3364 | - |
dc.identifier.scopusid | 2-s2.0-85018791622 | - |
dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/21990 | - |
dc.identifier.url | http://pubs.rsc.org/en/Content/ArticleLanding/2017/NR/C6NR09610G#!divAbstract | - |
dc.identifier.wosid | 000399809400006 | - |
dc.language | 영어 | - |
dc.publisher | ROYAL SOC CHEMISTRY | - |
dc.title | 3D-printable, highly conductive hybrid composites employing chemically-reinforced, complex dimensional fillers and thermoplastic triblock copolymers | - |
dc.type | Article | - |
dc.description.isOpenAccess | FALSE | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Multidisciplinary; Nanoscience & Nanotechnology; Materials Science, Multidisciplinary; Physics, Applied | - |
dc.relation.journalResearchArea | Chemistry; Science & Technology - Other Topics; Materials Science; Physics | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.subject.keywordPlus | PRINTED ELECTRONICS | - |
dc.subject.keywordPlus | INK | - |
dc.subject.keywordPlus | SILVER | - |
dc.subject.keywordPlus | LAYER | - |
dc.subject.keywordPlus | MICROSTRUCTURES | - |
dc.subject.keywordPlus | FABRICATION | - |
dc.subject.keywordPlus | THIN-FILM TRANSISTORS | - |
dc.subject.keywordPlus | FREE CU NANOPARTICLES | - |
dc.subject.keywordPlus | CARBON NANOTUBES | - |
dc.subject.keywordPlus | STRETCHABLE CONDUCTORS | - |
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