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김학선

Kim, Hak Sun
Internet of Things System Lab.
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dc.citation.endPage 407 -
dc.citation.number 5 -
dc.citation.startPage 395 -
dc.citation.title 한국전파학회논문지 -
dc.citation.volume 7 -
dc.contributor.author 정명래 -
dc.contributor.author 김학선 -
dc.date.accessioned 2023-12-22T12:38:20Z -
dc.date.available 2023-12-22T12:38:20Z -
dc.date.created 2017-03-14 -
dc.date.issued 1996-12 -
dc.description.abstract In this paperm, we describe the crossover of the parasitic capacitance at the interconnections for the system munuature, analyse ground capacitance and mutual capacitance due to actually coupled line in the ICs or MCCs. From the results of deviding interconnection line with infinite parts, using Green;s function with image charge method and moments, we could obtain 70% decrease of system suntime without difference of reference. In the designing ot layout of MMIC, PCB, MCM, we can easily use parastic inductance because of simplicity of transforming formular. -
dc.identifier.bibliographicCitation 한국전파학회논문지, v.7, no.5, pp.395 - 407 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/21632 -
dc.identifier.url http://www.dbpia.co.kr/Journal/ArticleDetail/NODE00257521 -
dc.language 한국어 -
dc.publisher 한국전파학회 -
dc.title.alternative A Study on the Interconnection Parameter Extraction Method in the Radio Frequency Circuits -
dc.title RF회로의 Interconnection Parameter 추출법에 관한 연구 -
dc.type Article -
dc.description.journalRegisteredClass other -

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