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김학선

Kim, Hak Sun
Internet of Things System Lab.
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RF회로의 Interconnection Parameter 추출법에 관한 연구

Alternative Title
A Study on the Interconnection Parameter Extraction Method in the Radio Frequency Circuits
Author(s)
정명래김학선
Issued Date
1996-12
URI
https://scholarworks.unist.ac.kr/handle/201301/21632
Fulltext
http://www.dbpia.co.kr/Journal/ArticleDetail/NODE00257521
Citation
한국전파학회논문지, v.7, no.5, pp.395 - 407
Abstract
In this paperm, we describe the crossover of the parasitic capacitance at the interconnections for the system munuature, analyse ground capacitance and mutual capacitance due to actually coupled line in the ICs or MCCs. From the results of deviding interconnection line with infinite parts, using Green;s function with image charge method and moments, we could obtain 70% decrease of system suntime without difference of reference. In the designing ot layout of MMIC, PCB, MCM, we can easily use parastic inductance because of simplicity of transforming formular.
Publisher
한국전파학회

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