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- Byon, Chan
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.endPage | 2072 | - |
| dc.citation.number | 9-10 | - |
| dc.citation.startPage | 2066 | - |
| dc.citation.title | INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER | - |
| dc.citation.volume | 54 | - |
| dc.contributor.author | Byon, Chan | - |
| dc.contributor.author | Choo, Kyosung | - |
| dc.contributor.author | Kim, Sung Jin | - |
| dc.date.accessioned | 2023-12-22T06:12:14Z | - |
| dc.date.available | 2023-12-22T06:12:14Z | - |
| dc.date.created | 2017-02-26 | - |
| dc.date.issued | 2011-04 | - |
| dc.description.abstract | In this study, the effects of various chip thicknesses on the chip hot spot temperature are investigated using both experimental and analytical methods. The temperature distribution in the chip is measured under the various chip thicknesses (21.5-400 mu m) and various heater power conditions (0.2-0.5 W). In order to support the experimental data and gain a physical insight, closed-form analytic expressions are suggested. Based on the suggested analytic expressions, the effects of the nondimensional contact radius, nondimensional substrate thickness, and the Biot number are investigated. | - |
| dc.identifier.bibliographicCitation | INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.54, no.9-10, pp.2066 - 2072 | - |
| dc.identifier.doi | 10.1016/j.ijheatmasstransfer.2010.12.022 | - |
| dc.identifier.issn | 0017-9310 | - |
| dc.identifier.scopusid | 2-s2.0-79952279991 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/21496 | - |
| dc.identifier.url | http://www.sciencedirect.com/science/article/pii/S0017931010007155 | - |
| dc.identifier.wosid | 000289011700038 | - |
| dc.language | 영어 | - |
| dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
| dc.title | Experimental and analytical study on chip hot spot temperature | - |
| dc.type | Article | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
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