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김주영

Kim, Ju-Young
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dc.citation.endPage 9 -
dc.citation.startPage 1 -
dc.citation.title INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE -
dc.citation.volume 113 -
dc.contributor.author Choi, Da-Hee -
dc.contributor.author Lee, Je-Ryung -
dc.contributor.author Kang, Na-Ri -
dc.contributor.author Je, Tae-Jin -
dc.contributor.author Kim, Ju-Young -
dc.contributor.author Jeon, Eun-Chae -
dc.date.accessioned 2023-12-21T22:41:21Z -
dc.date.available 2023-12-21T22:41:21Z -
dc.date.created 2016-11-28 -
dc.date.issued 2017-02 -
dc.description.abstract Nano patterns on single-crystal silicon are generally manufactured by photolithography, which can form limited cross-sectional shapes such as U-shapes or rectangular channels. Though V-shaped patterns are widely used in the optical industries because they concentrate light, they are challenging to manufacture by conventional photolithography. Mechanical machining is useful in manufacturing various kinds of cross-sectional shapes including V-shapes with various apex angles, but is hard to apply to single-crystal silicon due to its brittle fracture. Here we suggest a novel way of mechanical machining of single-crystal silicon that suppresses brittle fracture below the critical point (the ductile-brittle transition point) as determined by nano-scratch testing. We find that the first drop point of the cutting force corresponds to a critical point and define the critical forces as the thrust force and the cutting force at the critical point. The critical forces are varied by the applied force per unit length, which is the possibility that the cutting tool interacts with mechanically weak atomic bonds. When the applied force per unit length is zero (a general condition of mechanical machining), the cutting speed does not affect the variation of the critical forces or the quality of the machined pattern. Based on analysis of the experimental results, we suggest that the single-crystal silicon can be mechanically machined without brittle fracture at high cutting speed if the thrust force is smaller than the critical force of zero applied force per unit length. -
dc.identifier.bibliographicCitation INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, v.113, pp.1 - 9 -
dc.identifier.doi 10.1016/j.ijmachtools.2016.10.006 -
dc.identifier.issn 0890-6955 -
dc.identifier.scopusid 2-s2.0-84994588736 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/20756 -
dc.identifier.url http://www.sciencedirect.com/science/article/pii/S0890695516301419 -
dc.identifier.wosid 000392353000001 -
dc.language 영어 -
dc.publisher ELSEVIER SCI LTD -
dc.title Study on ductile mode machining of single-crystal silicon by mechanical machining -
dc.type Article -
dc.description.isOpenAccess FALSE -
dc.relation.journalWebOfScienceCategory Engineering, Manufacturing; Engineering, Mechanical -
dc.relation.journalResearchArea Engineering -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.subject.keywordAuthor Mechanical machining -
dc.subject.keywordAuthor Single-crystal silicon -
dc.subject.keywordAuthor Critical force -
dc.subject.keywordAuthor Ductile-brittle transition point -
dc.subject.keywordAuthor Brittle fracture -
dc.subject.keywordPlus CUTTING SPEED -
dc.subject.keywordPlus FABRICATION -
dc.subject.keywordPlus LITHOGRAPHY -
dc.subject.keywordPlus NANOIMPRINT -
dc.subject.keywordPlus STEEL -
dc.subject.keywordPlus LOAD -

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