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김진국

Kim, Jingook
Integrated Circuit and Electromagnetic Compatibility Lab.
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dc.citation.endPage 1647 -
dc.citation.number 11 -
dc.citation.startPage 1638 -
dc.citation.title IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY -
dc.citation.volume 6 -
dc.contributor.author Jeong, Jongwoo -
dc.contributor.author Kim, Jingook -
dc.contributor.author Kang, No-Weon -
dc.contributor.author Han, Ki Jin -
dc.date.accessioned 2023-12-21T23:08:07Z -
dc.date.available 2023-12-21T23:08:07Z -
dc.date.created 2016-11-10 -
dc.date.issued 2016-11 -
dc.description.abstract As a solution to the need for efficient characterization of the vertical interconnection array, this paper presents an indirect contact probing method, adopting a dielectric contactor. The dielectric contactor protects vertical interconnections, resolves the issue of probe misalignments, and increases the coupling between probe tips and devices under test (DUTs). The characterization procedure is composed of the extraction of the dielectric contactor characteristic, the indirect contact measurement of DUTs, and de-embedding to obtain the DUT characteristics. To realize the multiport measurement, we propose an approximate method to formulate the scattering matrix of the dielectric contactor. For the design of calibration vias, the coaxial transmission line model with lumped elements is used, enhancing the available bandwidth of measurement. To verify the proposed method, a two-port network of two vias is characterized by numerical simulations up to 20 GHz. With the presented measurement setup, three cases of two vias are characterized up to 12 GHz. For the testing approach, DUTs containing open and short defects are fully tested by observing impedance curves up to 20 GHz. -
dc.identifier.bibliographicCitation IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.11, pp.1638 - 1647 -
dc.identifier.doi 10.1109/TCPMT.2016.2613823 -
dc.identifier.issn 2156-3950 -
dc.identifier.scopusid 2-s2.0-84996922173 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/20696 -
dc.identifier.url http://ieeexplore.ieee.org/document/7589968/ -
dc.identifier.wosid 000388675300007 -
dc.language 영어 -
dc.publisher IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC -
dc.title High-frequency testing of vertical interconnection array using indirect contact probing method with an improved calibration -
dc.type Article -
dc.description.isOpenAccess FALSE -
dc.relation.journalWebOfScienceCategory Engineering, Manufacturing; Engineering, Electrical & Electronic; Materials Science, Multidisciplinary -
dc.relation.journalResearchArea Engineering; Materials Science -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.subject.keywordAuthor Calibration -
dc.subject.keywordAuthor de-embedding -
dc.subject.keywordAuthor multiple vias -
dc.subject.keywordAuthor noncontact measurement -
dc.subject.keywordAuthor package -
dc.subject.keywordPlus WAFER-LEVEL -
dc.subject.keywordPlus CHIP -

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