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DC Field | Value | Language |
---|---|---|
dc.citation.endPage | 7465 | - |
dc.citation.number | 34 | - |
dc.citation.startPage | 7457 | - |
dc.citation.title | ADVANCED MATERIALS | - |
dc.citation.volume | 28 | - |
dc.contributor.author | Lee, Hochan | - |
dc.contributor.author | Um, Doo-Seung | - |
dc.contributor.author | Lee, Youngsu | - |
dc.contributor.author | Lim, Seongdong | - |
dc.contributor.author | Kim, Hyung-jun | - |
dc.contributor.author | Ko, Hyunhyub | - |
dc.date.accessioned | 2023-12-21T23:14:38Z | - |
dc.date.available | 2023-12-21T23:14:38Z | - |
dc.date.created | 2016-07-14 | - |
dc.date.issued | 2016-09 | - |
dc.description.abstract | By mimicking muscle actuation to control cavity-pressure-induced adhesion of octopus suckers, smart adhesive pads are developed in which the thermo-responsive actuation of a hydrogel layer on elastomeric microcavity pads enables excellent switchable adhesion in response to a thermal stimulus (maximum adhesive strength: 94 kPa, adhesion switching ratio: approximate to 293 for temperature change between 22 and 61 degrees C). | - |
dc.identifier.bibliographicCitation | ADVANCED MATERIALS, v.28, no.34, pp.7457 - 7465 | - |
dc.identifier.doi | 10.1002/adma.201601407 | - |
dc.identifier.issn | 0935-9648 | - |
dc.identifier.scopusid | 2-s2.0-84985920185 | - |
dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/20423 | - |
dc.identifier.url | http://onlinelibrary.wiley.com/doi/10.1002/adma.201601407/abstract | - |
dc.identifier.wosid | 000383778700015 | - |
dc.language | 영어 | - |
dc.publisher | WILEY-V C H VERLAG GMBH | - |
dc.title | Octopus-Inspired Smart Adhesive Pads for Transfer Printing of Semiconducting Nanomembranes | - |
dc.type | Article | - |
dc.description.isOpenAccess | FALSE | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Multidisciplinary; Chemistry, Physical; Nanoscience & Nanotechnology; Materials Science, Multidisciplinary; Physics, Applied; Physics, Condensed Matter | - |
dc.relation.journalResearchArea | Chemistry; Science & Technology - Other Topics; Materials Science; Physics | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.subject.keywordAuthor | III-V semiconductor transistors | - |
dc.subject.keywordAuthor | bioinspired | - |
dc.subject.keywordAuthor | smart adhesives | - |
dc.subject.keywordAuthor | thermoresponsive | - |
dc.subject.keywordAuthor | transfer printing | - |
dc.subject.keywordPlus | FIELD-EFFECT TRANSISTORS | - |
dc.subject.keywordPlus | REVERSIBLE ADHESION | - |
dc.subject.keywordPlus | FIBRILLAR ADHESIVE | - |
dc.subject.keywordPlus | THERMORESPONSIVE HYDROGELS | - |
dc.subject.keywordPlus | SWITCHABLE ADHESION | - |
dc.subject.keywordPlus | WET ADHESION | - |
dc.subject.keywordPlus | DRY ADHESIVE | - |
dc.subject.keywordPlus | TREE FROGS | - |
dc.subject.keywordPlus | GECKO | - |
dc.subject.keywordPlus | ELECTRONICS | - |
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