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강석주

Kang, Seok Ju
Smart Materials for Energy Lab.
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Chemically Cross-Linked Thin Poly(vinylidene fluoride-co-trifluoroethylene)Films for Nonvolatile Ferroelectric Polymer Memory

Author(s)
Shin, Yu JinKang, Seok JuJung, Hee JoonPark, Youn JungBae, InsungChoi, Dong HoonPark, Cheolmin
Issued Date
2011-02
DOI
10.1021/am1011657
URI
https://scholarworks.unist.ac.kr/handle/201301/18466
Fulltext
http://pubs.acs.org/doi/abs/10.1021/am1011657
Citation
ACS APPLIED MATERIALS & INTERFACES, v.3, no.2, pp.582 - 589
Abstract
Both chemically and electrically robust ferroelectric poly(vinylidene fluoride-co-trifluoro ethylene) (PVDF-TrFE) films were developed by spin-coating and subsequent thermal annealing with the thermal cross-linking agent 2,4,4-trimethyl-1,6-hexanediamine (THDA). Well-defined ferroelectric beta crystalline domains were developed with THDA up to approximately 50 wt %, with respect to polymer concentration; resulting in characteristic ferroelectric hysteresis polarization-voltage loops in metal/cross-linked ferroelectric layer/metal capacitors with remnant polarization of approximately 4 mu C/cm(2). Our chemically networked film allowed for facile stacking of a solution-processable organic semiconductor on top of the film, leading to a bottom-gate ferroelectric field effect transistor (FeFET). A low-voltage operating FeFET was realized with a networked PVDF-TrFE film, which had significantly reduced gate leakage current between the drain and gate electrodes. A solution-processed single crystalline tri-isopropylsilylethynyl pentacene FeFET with a chemically cross-linked PVDF-TrFE film showed reliable I-V hysteresis with source-drain ON/OFF current bistablility of 1 x 10(3) at a sweeping gate voltage of +/- 20 V. Furthermore, both thermal micro/nanoimprinting and transfer printing techniques were conveniently combined for micro/nanopatterning of chemically resistant cross-linked PVDF-TrFE films
Publisher
AMER CHEMICAL SOC
ISSN
1944-8244

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