고내열성 전기 절연용 Poly(ester-imide) 수지의 합성 및 물성

Abstract

내열성 전기 절연 coating에 사용되는 기본 수지인 poly(ester-imide) (PEI)의 1단계 및 2단계 합성법을 비교하였으며 촉매의 영향도 조사하였다. Poly(ester-imide) 수지의 합성에 있어서 trimellitic anhydride(TMA)와 methylene dianiline(MDA)으로부터 imide 반복 단위를 구성하는 N,N''-(4,4''-diphenylmethane)bistrimellitimide(DID)를 먼저 합성하고 에스테르화 반응을 시키는 2단계법과 TMA, MDA, dimethyl terephthalate(DMT) 및 ethylene glyocol(EG), 1,3,5-tris-(2-hydroxy ethyl)isocyanurate(THEIC)를 모두 m-cresol 용매에 넣고 반응시키는 1단계법이 동등한 PEI 수지를 생성함을 확인할 수 있었다. 합성된 poly(ester-imide) 수지 용액에 xylene, phenol-formaldehyde 수지인 P-5030K, TDI type blocked isocyanate인 TK-8 및 tetrapropyltitanate(TPT)를 첨가하여 경화 반응을 시키고 생성된 피막의 유연성 및 투명도를 조사한 결과 히드록실기의 함량, DMT의 첨가 및 imide 반복 단위의 함량이 내열성 절연 코팅의 물성에 중요한 인자로 작용함을 알 수 있었다.

Poly(ester-imide)(PEI) for the electrical insulation coating was synthesized and evaluated with one-step method as well as two-step method. For the synthesis of poly(ester-imide), imide repeat unit of N,N`-(4,4`-diphenylmethane) bistrimellitimide(DID) was initially made from trimellitic anhydride(TMA) and methylene dianiline(MDA), followed by the second stage reaction of esterification. One-step reaction was performed by reaction of TMA, MDA, dimethyl terephthalate(DMT), ethylene glycol(EG), and 1,3,5-tris-(2-hydroxy ethyl) isocyanurate(THEIC) in m-cresol solvent at a time. The synthesized poly(ester-imide) was cured with xylene, P-5030K(phenol-formaldehyde resin), TK-8(TDI type blocked polyisocyanate) and tetrapropyltitanate(TPT). It was found that the content of hydroxyl group, amount of DMT, and imide repeat unit played important role for the properties of electrical insulation coating film.