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Wicking performance of two-dimensional bi-porous wicks File

Byon, Chan , Kim, Sung Jin

Conference Paper Issue Date2011-11-15 View9
C-MES 시스템의 생산 프로세스 모니터링 기능에 대한 연구

Kim, Duck Young

Conference Paper Issue Date2011 View11
An Integrated Collaboration Model for the Business Process Innovation for Small and Medium Sized Manufacturing Firms

Kim, Duck Young

Conference Paper Issue Date2011 View6
Degradation of Digital Signal Characteristics due to Intermediate Stages of Interconnect Failure File

Kwon, Daeil , Azarian, M.H. , Pecht, M.

Conference Paper Issue Date2010-05-09 View12
Comparative Analysis of Interconnect Degradation using RF Impedance and Event Detectors

Kwon, Daeil , None

Conference Paper Issue Date2010-04-06 View12
Identification of Interconnect Failure Mechanisms Using RF Impedance Analysis File

Kwon, Daeil , None

Conference Paper Issue Date2009-51-02 View13
The Effect of Surface Treatment on the Drag Characteristics in Laminar Flow File

Byon, Chan , Nam, Youngsuk , Kim, Sung Jin , Ju, Yongho Sungtaek

Conference Paper Issue Date2009-12-20 View12
Use of Skin Effect for Detection of Interconnect Degradation

Azarian, M.H. , Kwon, Daeil , Pecht, M.

Conference Paper Issue Date2009-09-01 View9
Detection of Solder Joint Failure Precursors on Tin-Lead and Lead-Free Assemblies Using RF Impedance Analysis File

Kwon, Daeil , Azarian, Michael H. , Pecht, Michael

Conference Paper Issue Date2009-05-26 View6
Thermal analysis of natural-convection-cooled heat sinks using the volume-averaging approach File

Byon, Chan , Kim, Sung Jin

Conference Paper Issue Date2008-11-04 View11
Early detection of interconnect degradation using RF impedance and SPRT File

Kwon, Daeil , Azarian, M.H. , Pecht, M.G.

Conference Paper Issue Date2008-10-06 View17
Detection of Solder Joint Degradation Using RF Impedance Analysis File

Kwon, Daeil , Azarian, M.H. , Pecht, M.G.

Conference Paper Issue Date2008-05-27 View10
Effect of Solder Joint Degradation on RF Impedance File

Kwon, Daeil , Azarian, M.H. , Pecht, M.G.

Conference Paper Issue Date2008-05-12 View13
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