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Wicking performance of two-dimensional bi-porous wicks File

Byon, Chan , Kim, Sung Jin

Conference Paper Issue Date2011-11-15 View61
C-MES 시스템의 생산 프로세스 모니터링 기능에 대한 연구

Kim, Duck Young

Conference Paper Issue Date2011 View77
An Integrated Collaboration Model for the Business Process Innovation for Small and Medium Sized Manufacturing Firms

Kim, Duck Young

Conference Paper Issue Date2011 View34
Degradation of Digital Signal Characteristics due to Intermediate Stages of Interconnect Failure File

Kwon, Daeil , Azarian, M.H. , Pecht, M.

Conference Paper Issue Date2010-05-09 View54
Comparative Analysis of Interconnect Degradation using RF Impedance and Event Detectors

Kwon, Daeil , None

Conference Paper Issue Date2010-04-06 View41
Identification of Interconnect Failure Mechanisms Using RF Impedance Analysis File

Kwon, Daeil , None

Conference Paper Issue Date2009-51-02 View55
The Effect of Surface Treatment on the Drag Characteristics in Laminar Flow File

Byon, Chan , Nam, Youngsuk , Kim, Sung Jin , Ju, Yongho Sungtaek

Conference Paper Issue Date2009-12-20 View71
Use of Skin Effect for Detection of Interconnect Degradation

Azarian, M.H. , Kwon, Daeil , Pecht, M.

Conference Paper Issue Date2009-09-01 View46
Detection of Solder Joint Failure Precursors on Tin-Lead and Lead-Free Assemblies Using RF Impedance Analysis File

Kwon, Daeil , Azarian, Michael H. , Pecht, Michael

Conference Paper Issue Date2009-05-26 View39
Thermal analysis of natural-convection-cooled heat sinks using the volume-averaging approach File

Byon, Chan , Kim, Sung Jin

Conference Paper Issue Date2008-11-04 View76
Early detection of interconnect degradation using RF impedance and SPRT File

Kwon, Daeil , Azarian, M.H. , Pecht, M.G.

Conference Paper Issue Date2008-10-06 View64
Detection of Solder Joint Degradation Using RF Impedance Analysis File

Kwon, Daeil , Azarian, M.H. , Pecht, M.G.

Conference Paper Issue Date2008-05-27 View67
Effect of Solder Joint Degradation on RF Impedance File

Kwon, Daeil , Azarian, M.H. , Pecht, M.G.

Conference Paper Issue Date2008-05-12 View44
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