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dc.citation.endPage 417 -
dc.citation.number 3 -
dc.citation.startPage 404 -
dc.citation.title IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS -
dc.citation.volume 31 -
dc.contributor.author Kahng, Andrew B. -
dc.contributor.author Kang, Seokhyeong -
dc.contributor.author Kumar, Rakesh -
dc.contributor.author Sartori, John -
dc.date.accessioned 2023-12-22T05:15:53Z -
dc.date.available 2023-12-22T05:15:53Z -
dc.date.created 2015-07-03 -
dc.date.issued 2012-03 -
dc.description.abstract Conventional computer-aided design (CAD) methodologies optimize a processor module for correct operation and prohibit timing violations during nominal operation. We propose recovery-driven design, a design approach that optimizes a processor module for a target timing error rate (ER) instead of correct operation. The target ER is chosen based on how many errors can be gainfully tolerated by a hardware or software error resilience mechanism. We show that significant power benefits are possible from a recovery-driven design approach that deliberately allows errors caused by voltage overscaling to occur during nominal operation, while relying on an error resilience technique to tolerate these errors. We present a detailed evaluation and analysis of such a CAD methodology that minimizes the power of a processor module for a target ER. We show how this design-level methodology can be extended to design recovery-driven processors-processors that are optimized to take advantage of hardware or software error resilience. We also discuss a gradual slack recovery-driven design approach that optimizes for a range of ERs to create soft processors-processors that have graceful failure characteristics and the ability to trade throughput or output quality for additional energy savings over a range of ERs. We demonstrate significant power benefits over conventional design-11.8% on average over all modules and ER targets, and up to 29.1% for individual modules. Processor-level benefits were 19.0%, on average. Benefits increase when recovery-driven design is coupled with an error resilience mechanism or when the number of available voltage domains increases -
dc.identifier.bibliographicCitation IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, v.31, no.3, pp.404 - 417 -
dc.identifier.doi 10.1109/TCAD.2011.2172610 -
dc.identifier.issn 0278-0070 -
dc.identifier.scopusid 2-s2.0-84863411602 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/11875 -
dc.identifier.url http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6152777&tag=1 -
dc.identifier.wosid 000300513500007 -
dc.language 영어 -
dc.publisher IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC -
dc.title Recovery-Driven Design: Exploiting Error Resilience in Design of Energy-Efficient Processors -
dc.type Article -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.subject.keywordAuthor Cell sizing -
dc.subject.keywordAuthor error resilience -
dc.subject.keywordAuthor power minimization -
dc.subject.keywordAuthor recovery-driven design -
dc.subject.keywordAuthor slack redistribution -
dc.subject.keywordPlus RUNTIME-LEAKAGE CONTROL -
dc.subject.keywordPlus TRADEOFFS -
dc.subject.keywordPlus CIRCUITS -

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