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Effects of Back Metal on the DC and RF Characteristics of 3D Stacked InGaAs RF Device for Monolithic 3D RF Applications File

Jeong, Jaeyong , Kim, Seong Kwang , Kim, Jongmin , Geum, Dae-Myeong , Kim, Sanghyeon

Article Issue Date2023-04 View0
Heterogeneous and Monolithic 3D Integrated Full-Color Micro-Light-Emitting Diodes via CMOS-Compatible Oxide Bonding for μLEDoS File File

Kim, Hyun soo , Park, Juhyuk , Baek, Woo Jin , Geum, Dae-Myeong , Kim, Inki , Lim, Hyeongrak , Lim, Jinha , Kim, Seong Kwang , Jeong, Jaeyong , Shim, Joonsup , et al

Article Issue Date2025-08 View0
Heterogeneous and Monolithic 3D Integration of III-V-Based Radio Frequency Devices on Si CMOS Circuits File

Jeong, Jaeyong , Kim, Seong Kwang , Kim, Jongmin , Geum, Dae-Myeong , Kim, Duckhyun , Jo, Eunju , Jeong, Hakcheon , Park, Juyeong , Jang, Jae-Hyung , Choi, Shinhyun , et al

Article Issue Date2022-06 View3
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