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3-D On-Chip Integration of GaN Power Devices on Power Delivery Network (PDN) With Direct Heat Spreading Layer Bonding for Heterogeneous 3-D (H3D) Stacked Systems File

Jeong, Jaeyong , Lee, Chan Jik , Choi, Sung Joon , Rheem, Nahyun , Song, Minseo , Suh, Yoon-Je , Kim, Bong Ho , Kim, Joon Pyo , Shim, Joonsup , Lee, Jiseon , et al

Article Issue Date2025-05 View0
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