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Improving bending fatigue lifetime and interfacial adhesion of Cu-Mn flexible interconnects using self-forming nanolayer File File

Lee, Seongi , Shin, Jae-Myeong , Lee, Jong-Sung , Kim, Dong Hyeon , Jeon, Eun-Chae , Joo, Young-Chang , Lee, So-Yeon , Kim, Byoung-Joon

Article Issue Date2026-01 View12
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